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1 features description applications tpa2100p1 www.ti.com ........................................................................................................................................................................................... slos595 ? december 2008 19-v pp mono class-d audio amplifier for piezo/ceramic speakers 2 19 v pp output load voltage from a 2.5 v supply the tpa2100p1 (sometimes referred to as tpa2100) is a mono, class-d audio power amplifier with integrated dc-dc converter generates 10 v integrated dc-dc converter designed for piezo and supply ceramic speakers. the tpa2100p1 (tpa2100) is no external schottky diode required capable of driving a ceramic / piezo speaker with integrated audio input low-pass filter 19 v pp (6.7 v rms ) from a 2.5 v power supply at less than 1% thd+n. small boost converter inductor supply voltage range from 2.5 v to 5.5 v the dc-dc converter operates at a fixed frequency of 1.2 mhz. the tpa2100p1 (tpa2100) dc-dc selectable gain of 12 db, 16 db, and 24 db converter provides a 10 v supply with a minimum independent shutdown control for the boost number of external components. the dc-dc converter and the audio amplifier converter can be used to drive other components that fast startup time: 8 ms require a 10 v supply voltage (note: audio signal must be present for proper functionality of boost low supply current: 5.5 ma converter). low shutdown current: < 1 m a the tpa2100p1 (tpa2100) features an integrated short-circuit and thermal protection audio low pass filter that rejects high frequency noise space saving package (codec out-of-band and rf noise) thus improving ? 2,1 mm 2,1 mm nanofree? wcsp (yzh) audio fidelity. the tpa2100p1 (tpa2100) has three gain modes of 12 db, 16 db, and 24 db. the tpa2100p1 wireless or cellular handsets (tpa2100) provides thermal and short circuit portable dvd player protection on the boost converter and the class-d audio amplifier. the tpa2100p1 (tpa2100) is personal digital assistants (pdas) available in a 16-ball 2,1 mm 2,1 mm wcsp electronic dictionaries package. the tpa2100p1 (tpa2100) requires only digital still cameras one small external inductor for operation. 1 please be aware that an important notice concerning availability, standard warranty, and use in critical applications of texas instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. 2 nanofree is a trademark of texas instruments. production data information is current as of publication date. copyright ? 2008, texas instruments incorporated products conform to specifications per the terms of the texas instruments standard warranty. production processing does not necessarily include testing of all parameters. yzh vdd sw in- in+ gnd out+ out- vccout vccin c in c in sd sda gain piezo speaker digital baseband analog baseband or codec v in 2.5 v to 5.5 v vref bst 10 nf 10 f m 4.7 h m 1 f m 5 ~ 10 w 5 ~ 10 w 1 f m 0.1 ~ 2 f m 10 f m gnd
device pinout tpa2100p1 slos595 ? december 2008 ........................................................................................................................................................................................... www.ti.com these devices have limited built-in esd protection. the leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the mos gates. yzh wcsp) package (top view) pin functions pin i/o/p description name wcsp in+ d3 i positive differential audio input in ? d2 i negative differential audio input sda c3 i audio amplifier shutdown gain b2 i gain selection (tri-state input) sd d4 i device shutdown vref c2 o internal analog supply (do not connect to external supply/circuit) out+ b1 o positive differential audio output out ? c1 o negative differential audio output bst b3 o reference voltage for boost converter v dd b4 p power supply v cc out a2 p dc-dc converter output voltage v cc in a1 p audio amplifier power supply sw a3 p boost and rectifying switch input gnd a4, c4,d1 p ground 2 submit documentation feedback copyright ? 2008, texas instruments incorporated product folder link(s): tpa2100p1 sda in+ inC gnd gnd vccout sw vccin vdd bst gain out+ gnd vref outC sd d1 d2 d3 d4 c1 c2 c3 c4 b1 b3 b4 b2 a1 a2 a3 a4
absolute maximum ratings (1) dissipation ratings (1) available options tpa2100p1 www.ti.com ........................................................................................................................................................................................... slos595 ? december 2008 over operating free-air temperature range (unless otherwise noted) value unit supply voltage, v dd ? 0.3 to 6.0 v amplifier supply voltage, vccout, vccin ? 0.3 to 12.0 v v i input voltage, in-, in+, sda, sd, gain ? 0.3 to v dd + 0.3 v output continuous total power dissipation see dissipation rating table t a operating free-air temperature range ? 40 to 85 c t j operating junction temperature range ? 40 to 150 c t stg storage temperature range ? 65 to 150 c esd protection ? hbm (all pins) 2 kv (1) stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. these are stress ratings only, and functional operations of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. package t a 25 c derating factor t a = 70 c t a = 85 c 16-ball wcsp (yzh) 1.66 w 13.3 mw/ c 1.06 w 0.86 w (1) dissipation ratings are for a 2-side, 2-plane board jedec high k board. t a packaged devices (1) part number (2) symbol TPA2100P1YZHR ? 40 c to 85 c 16-ball wcsp, 2,1mm 2,1 mm (+ 0,01 / ? 0,09 mm) ceh tpa2100p1yzht (1) for the most current package and ordering information see the package option addendum at the end of this document, or see the ti website at www.ti.com . (2) the yzh package is only available taped and reeled. the suffix " r " indicates a reel of 3000; the suffix " t " indicates a reel of 250. copyright ? 2008, texas instruments incorporated submit documentation feedback 3 product folder link(s): tpa2100p1
recommended operating conditions electrical characteristics tpa2100p1 slos595 ? december 2008 ........................................................................................................................................................................................... www.ti.com min max unit supply voltage v dd 2.5 5.5 v output voltage range vccin, vccout 9.5 10.5 v v ih high-level input voltage sd, sda 1.3 v v il low-level input voltage sd, sda 0.6 v i ih high-level input current sd, sda, v dd = 2.5 v to 5.5 v 1 m a i il low-level input current sd, sda, v dd = 2.5 v to 5.5 v 1 m a f osc oscillator frequency 1.1 1.3 mhz t a operating free-air temperature ? 40 85 c t a = 25 c, sd 1.3 v, gain = 12 db, load = 10 ? +1 m f + 33 m h (unless otherwise noted) parameter test conditions min typ max unit v dd supply voltage range 2.5 3.6 5.5 v i sd shutdown quiescent current sd 0.35 v, v dd = 2.5 v to 5.5 v 0.5 1 m a v dd = 3.0 v 6 9 i dd supply current v dd = 3.6 v 5.5 8 ma v dd = 5.5 v 4 5 f sw class-d switching frequency 250 300 350 khz f boost boost converter switching frequency 1.1 1.2 1.3 mhz por power on reset on threshold 2.2 v por power on reset hysteresis 0.2 v v in = 100 mv, v dd = 2.5 v 0.5 2.0 cmr input common mode range v in = 100 mv, v dd = 3.6 v 0.5 2.7 v v in = 100 mv, v dd = 5.5 v 0.5 2.7 v oos output offset voltage v dd = 3.6 v, av = 12 db, inputs ac 1.4 5 mv grounded z out output impedance in shutdown mode sd 0.35 v 2 k ? gain 0.35 v 11.3 11.8 12.3 a v gain 0.7 v gain 1 v 15.5 16 16.5 db gain 1.35 v 23.5 24 24.5 4 submit documentation feedback copyright ? 2008, texas instruments incorporated product folder link(s): tpa2100p1
operating characteristics typical characteristics tpa2100p1 www.ti.com ........................................................................................................................................................................................... slos595 ? december 2008 t a = 25 c, v dd = 3.6 v, sd = sda = 1.3 v, gain = 12 db, load = 10 ? + 1 m f + 22 m h (unless otherwise noted) parameter test conditions min typ max unit maximum output voltage thd+n = 1%, vdd = 3.0 v, l = 4.7 m h, 19 v outmax v pp swing f aud_in 10 khz total harmonic distortion plus f aud_in = 1 khz; v out = 10 to 18 v p-p 0.07% thd+n noise k svr supply ripple rejection ratio 200 mv pp supply ripple at 217 hz ? 100 db r l = 8 ? , v icm = 0.5v and v icm = vdd ? 0.8 v, cmrr input common mode rejection ? 60 db differential inputs shorted av = 12 db 23.2 z in input impedance av = 16 db 18.5 k ? av = 24 db 10 f = 20 to 20 khz, v out = 6 v rms , av = 12 db, 94 snr signal to noise ratio db a-weighted t on start up time (class-d and 2.5 v v dd 5.5 v, no turn-on pop, c in 1 m f 8 ms boost converter) t a = 25 c, v dd = 3.6 v, gain = 12 db, c in = 1 m f, l boost = 4.7 m h, c boost = 10 m f, sd = sda = 3.6 v, load = 10 ? + 1 m f + 22 m h (unless otherwise noted) quiescent supply current average power consumption vs vs supply voltage audio driver type figure 1. figure 2. copyright ? 2008, texas instruments incorporated submit documentation feedback 5 product folder link(s): tpa2100p1 0.00 0.05 0.10 0.15 0.20 0.25 0.30 0.35 0.40 average p ? w ower consumption class-abw. dynamic class-ab w. piezo a v dd = 3.6 v load = piezo speakerv o = 14 vpp max. tpa2100p1 w. piezo a class-d w. dynamic pop ringtone disco classical news ? intro news ? interview v dd ? supply voltage ? v 0 1 2 3 4 5 6 7 8 9 10 2.5 3.0 3.5 4.0 4.5 5.0 5.5 i dd ? quiescent supply current ? ma gain = 12 db sd sda = = 2 v
tpa2100p1 slos595 ? december 2008 ........................................................................................................................................................................................... www.ti.com typical characteristics (continued) t a = 25 c, v dd = 3.6 v, gain = 12 db, c in = 1 m f, l boost = 4.7 m h, c boost = 10 m f, sd = sda = 3.6 v, load = 10 ? + 1 m f + 22 m h (unless otherwise noted) total supply input power total supply current vs vs output voltage output voltage figure 3. figure 4. output voltage drive output voltage drive vs vs frequency frequency figure 5. figure 6. 6 submit documentation feedback copyright ? 2008, texas instruments incorporated product folder link(s): tpa2100p1 v o ? output voltage ? vrms 0.00 0.05 0.10 0.15 0.20 0.25 0 1 2 3 4 5 6 7 p - total supply power ? w sup frequency = 1 khz v dd = 3.6 v v dd = 5.5 v v dd = 2.5 v v o ? output voltage ? vrms 0 10 20 30 40 50 60 70 80 90 100 0 1 2 3 4 5 6 7 i dd ? t otal supply current ? ma frequency = 1 khz v dd = 3.6 v v dd = 5.5 v v dd = 2.5 v 0 1 2 3 4 5 6 7 8 9 10 f ? frequency ? hz thd = 1% @ 1 khz v o ? output v oltage drive ? v rms 20 100 1k 10k 20k v dd = 3.6 v v dd = 5.5 v v dd = 2.5 v 0 1 2 3 4 5 6 7 8 9 10 f ? frequency ? hz thd = 10% @ 1 khz v o ? output v oltage drive ? v rms 20 100 1k 10k 20k v dd = 3.6 v v dd = 2.5 v v dd = 5.5 v
tpa2100p1 www.ti.com ........................................................................................................................................................................................... slos595 ? december 2008 typical characteristics (continued) t a = 25 c, v dd = 3.6 v, gain = 12 db, c in = 1 m f, l boost = 4.7 m h, c boost = 10 m f, sd = sda = 3.6 v, load = 10 ? + 1 m f + 22 m h (unless otherwise noted) total harmonic distortion + noise total harmonic distortion + noise vs vs output voltage frequency figure 7. figure 8. total harmonic distortion + noise total harmonic distortion + noise vs vs frequency frequency figure 9. figure 10. copyright ? 2008, texas instruments incorporated submit documentation feedback 7 product folder link(s): tpa2100p1 v o ? output voltage ? vrms 0 1 2 3 4 5 6 7 8 thd+n ? t otal harmonic distortion + noise ? % 0.01 0.1 100 10 1 v dd = 3.6 v v dd = 2.5 v v dd = 5.5 v frequency = 1 khz f ? frequency ? hz 20 100 1k 10k thd+n ? t otal harmonic distortion + noise ? % 0.01 1 10 20k 0.1 v dd = 2.5 v v o = 6 vrms v o = 2 vrms v o = 4 vrms f ? frequency ? hz 20 100 1k 10k thd+n ? t otal harmonic distortion + noise ? % 0.01 1 10 20k 0.1 v dd = 3.6 v v o = 2 vrms v o = 4 vrms v o = 6 vrms f ? frequency ? hz 20 100 1k 10k thd+n ? t otal harmonic distortion + noise ? % 0.01 1 10 20k 0.1 v dd = 5.5 v v o = 2 vrms v o = 4 vrms v o = 6 vrms
tpa2100p1 slos595 ? december 2008 ........................................................................................................................................................................................... www.ti.com typical characteristics (continued) t a = 25 c, v dd = 3.6 v, gain = 12 db, c in = 1 m f, l boost = 4.7 m h, c boost = 10 m f, sd = sda = 3.6 v, load = 10 ? + 1 m f + 22 m h (unless otherwise noted) supply ripple rejection ratio gain and phase vs vs frequency frequency figure 11. figure 12. startup waveforms total supply input power and output voltage vs vs time input voltage figure 13. figure 14. 8 submit documentation feedback copyright ? 2008, texas instruments incorporated product folder link(s): tpa2100p1 ?110 ?100 ?90 ?80 ?70 ?60 ?50 ?40 ?30 ?20 ?10 f ? frequency ? hz ksvr ? supply ripple rejection ratio ? db 20 100 1k 10k 20k v dd = 5.5 v v dd = 3.6 v v = 200 mvpp ripple f ? frequency ? hz phase ? 5040 30 20 10 0 ?10 ?20 ?60 0 5 10 15 20 25 30 closed-loop response ? db ?30?40 ?50 20 100 1k 10k 20k c i = 1 m f v i = 100 mvrms gain = 24 db gain = 16 db gain = 12 db phase @ gain = 24 db phase @ gain = 12 db phase @ gain = 16 db t ? time ? ms ?3 ?1 1 3 5 7 9 11 13 0.000 0.005 0.010 0.015 0.020 v ? voltage ? v v dd = 3.6 v v cc v o sd sda and 0 2 4 6 8 10 12 0.0 0.5 1.0 1.5 2.0 2.5 v o ? output v oltage ? mv rms v ? input v i oltage ? mvrms 0.00 0.01 0.02 0.03 0.04 0.05 0.06 0.07 0.08 0.09 0.10 p - total supply power ? w sup v dd = 3.6 v supply input power output voltage
application information fully differential class-d audio power amplifier driving a ceramic/piezo speaker load configuration tpa2100p1 www.ti.com ........................................................................................................................................................................................... slos595 ? december 2008 the tpa2100p1 consists of a boost converter and a class-d amplifier. the boost converter takes a low supply voltage, vdd, and increases it to a higher output voltage, v cc out. v cc in is the power supply for the class-d amplifier. connect v cc out to v cc in. the tpa2100p1 is a fully differential amplifier. the fully differential amplifier includes a differential amplifier with common-mode feedback. the differential output is equal to the differential input times the gain. the common-mode feedback ensures that the common-mode voltage at the output is biased around v cc /2 (class-d supply voltage, v cc out, divided by 2) regardless of the common-mode voltage at the input. the fully differential tpa2100p1 can still be used with a single-ended input; however, the tpa2100p1 should be used with differential inputs when in a noisy environment, like a wireless handset, to ensure maximum noise rejection. input-coupling capacitors are not required: ? the tpa2100p1 inputs can be biased anywhere within the common mode input voltage range listed in the recommended operating conditions table. if the inputs are biased outside of that range, then input-coupling capacitors are required. mid-supply bypass capacitor, c bypass , is not required: ? the fully differential amplifier does not require a bypass capacitor. any shift in the midsupply affects both positive and negative channels equally and cancels at the differential output. excellent rf-immunity and supply noise rejection: ? gsm handsets save power by turning on and off the rf transmitter at 217 hz. the transmitted signal is picked-up on input, output, and power supply traces. the fully differential amplifier cancels the signal better than a typical audio amplifier. applications that require thin cases, such as mobile phones, demand that external components have a small form factor. dynamic loudspeakers that use a cone and voice coil typically cannot conform to the height requirements. the option for these applications is to use a ceramic/piezoelectric loudspeaker. ceramic speakers have a capacitive behavior unlike a conventional loudspeaker, which has an inductive behavior. typical capacitance values for ceramic/piezo speakers are as high as 2 m f. high peak-to-peak voltage drive is required to achieve acceptable sound pressure levels. ceramic/piezo speakers have low current consumption at frequencies up to 8 khz. the impedance of the ceramic/piezo speaker decreases with increasing audio frequency, thus requiring higher current as the frequency increases. however, audio signals in this range are higher harmonics of lower fundamentals, so the current demand is still small when compared to dynamic speaker current consumption. due to these characteristics, ceramic/piezo speakers are efficient in converting electrical audio signals into sound pressure in the mid and high audio bands (starting at 900 hz). the tpa2100p1 overcomes the challenges of driving a ceramic/piezo speaker. the tpa2100p1 drives the ceramic/piezo speaker with a constant output voltage over the battery life and across the audio frequency range. the tpa2100p1 can be configured in several different ways to drive a ceramic/piezo speaker. the most obvious configuration is to place a resistor on each output of the class-d amplifier. a more efficient configuration is to replace one resistor with an inductor at one of the outputs. a third way to configure is to place just one resistor between the output and the speaker and connect the other output directly to the speaker. for proper configuration of the load, it is important to observe the following variables: speaker capacitance ? c spk maximum available current from the boost converter ? i boostmax highest desired audio frequency ? f audmax maximum voltage allowed across the speaker ? v outpeak peak output current from the class-d amplifier ? i classdpeak copyright ? 2008, texas instruments incorporated submit documentation feedback 9 product folder link(s): tpa2100p1
resistor ? speaker ? resistor load configuration (1) (2) (3) resistor ? speaker ? inductor load configuration tpa2100p1 slos595 ? december 2008 ........................................................................................................................................................................................... www.ti.com this is the simplest configuration. however, this type of load configuration does not achieve the best efficiency possible. thus, it is recommended to use the resistor ? speaker ? inductor load configuration. the following figure shows an example of the resistor ? speaker ? resistor configuration. figure 15. application schematic with resistor ? speaker ? resistor load configuration for the rc load configuration, only two calculations are required. note that r in equation 1 is the sum of the two output resistors in figure 15 . the highest desired audio frequency will be limited by the rc low-pass filter configuration of the load: peak output current from the class-d amplifier should therefore be limited to the maximum audio frequency: where xc is: to calculate the proper boost converter inductor required for this application, see the inductor selection section. note that an input low-pass filter should be added before the audio amplifier in order to limit the audio frequency, f audmax . the second configuration with a resistor ? speaker ? inductor load is the most efficient configuration and is the preferred solution. figure 16 shows an example of this configuration. 10 submit documentation feedback copyright ? 2008, texas instruments incorporated product folder link(s): tpa2100p1 vdd sw in-in+ gnd gnd out + out - vccout vccin c in c in sd sda gain digital baseband analog baseband or codec v in 2 .5 v to 5.5 v vref bst 10 nf 10 f m 10 f m 1 f m 4.7 h m 5 ~ 10 w 5 ~ 10 w 1 f m 0.1 ~ 2 f m r r audmax spk 1 = 2 r c f p outpeak classdpeak 2 2 v i = r + xc audmax spk 1 xc = 2 f c p
(4) (5) (6) (7) (8) (9) resistor ? speaker load configuration tpa2100p1 www.ti.com ........................................................................................................................................................................................... slos595 ? december 2008 figure 16. application schematic with resistor ? speaker ? inductor load configuration for the resistor ? speaker ? inductor load configuration, it is desired to make the output load configuration overdamped (zeta ( z ) > 0.707). use equation 4 to calculate z : if z is greater than one, then the maximum audio frequency will be limited by the resistor ? speaker capacitance low pass filter as shown in equation 5 . calculate equivalent load impedance with equation 6 , through equation 9 . to calculate the proper boost converter inductor required for this application, see the inductor selection section. note that an input low pass filter should be added before the audio amplifier in order to limit the audio frequency, f audmax . this load configuration is similar to the resistor ? speaker ? resistor load configuration. apply the same equations here to calculate the maximum audio frequency and maximum required current from the class-d audio amplifier. copyright ? 2008, texas instruments incorporated submit documentation feedback 11 product folder link(s): tpa2100p1 vdd sw in- in+ gnd gnd out+ out- vccout vccin c in c in sd sda gain digital baseband analog baseband or codec vin 2.5v to 5.5 v vref bst 10 nf 1 f m 4.7 h m 10 f m 10 ~ 20 w 10 ~ 22 h m 10 f m 0.1 ~ 2 f m 1 f m r l spk r c = 2 l audmax spk 1 = 2 r c f p audmax spk 1 xc = 2 c f p audmax xl = 2 l f p ( ) 2 2 z = r + xl xc - outpeak classdpeak v i = z
boost converter inductor selection surface mount inductors tpa2100p1 inductor equations tpa2100p1 slos595 ? december 2008 ........................................................................................................................................................................................... www.ti.com figure 17. application schematic with resistor ? speaker load configuration there are two main passive components necessary for the functioning of a boost converter. the boost inductor stores current, and the boost capacitor stores charge. when the class-d amplifier depletes the charge in the boost capacitor, the boost inductor charges it back up with the stored current. the cycle of charge/discharge occurs at a frequency of f boost . the following is a list of terms and definitions used in the boost equations found in this document. c minimum boost capacitance required for a given ripple voltage on v cc l boost inductor f boost switching frequency of the boost converter. i cc current pulled by the class-d amplifier from the boost converter. i l average current through the boost inductor. v cc boost voltage. generated by the boost converter (v cc out). voltage supply for the class-d amplifier (v cc in). v dd supply voltage to the ic. i l ripple current through the inductor. v ripple voltage of v cc due to capacitance. v cc is the voltage on the vccout and vccin pins. working inductance decreases as inductor current increases. if the drop in working inductance is severe enough, it may cause the boost converter to become unstable, or cause the tpa2100p1 to reach its current limit at a lower output voltage than expected. inductor vendors specify currents at which inductor values decrease by a specific percentage. this can vary by 10% to 35%. inductance is also affected by dc current and temperature. inductor current rating is determined by the requirements of the load. the inductance is determined by two factors: the minimum value required for stability and the maximum ripple current permitted in the application. 12 submit documentation feedback copyright ? 2008, texas instruments incorporated product folder link(s): tpa2100p1 vdd sw in- in+ gnd gnd out+ out- vccout vccin c in c in sd sda gain digital baseband analog baseband or codec vin 2.5v to 5.5 v vref bst 10 nf 1 f m 4.7 h m 10 f m 10 ~ 20 w 10 f m 0.1 ~ 2 f m 1 f m r
(10) (11) capacitor selection surface mount capacitors tpa2100p1 www.ti.com ........................................................................................................................................................................................... slos595 ? december 2008 use equation 10 to determine the required current rating. equation 10 shows the approximate relationship between the average inductor current, i l , to the load current, load voltage, and input voltage (i cc , v cc , and v dd , respectively). insert i cc , v cc , and v dd into equation 10 to solve for i l . the inductor must maintain at least 90% of its initial inductance value at this current. the minimum working inductance is 3.3 m h. a lower value may cause instability. ripple current, i l , is peak-to-peak variation in inductor current. smaller ripple current reduces core losses in the inductor as well as the potential for emi. use equation 11 to determine the value of the inductor, l. equation 11 shows the relationship between inductance l, v dd , v cc , the switching frequency, f boost , and i l . insert the maximum acceptable ripple current into equation 11 to solve for l. i l is inversely proportional to l. minimize i l as much as is necessary for a specific application. increase the inductance to reduce the ripple current. note that making the inductance value of l greater than 10 m h will prevent the boost converter from responding to fast load changes properly. a typical inductor value for the tpa2100p1 is 4.7 m h. select an inductor with a dc resistance, dcr, no greater than 0.5 ? . dcr reduces the amount of power the device receives from the supply due to the voltage drop across the inductor. temperature and applied dc voltage influence the actual capacitance of high-k materials. table 1 shows the relationship between the different types of high-k materials and their associated tolerances, temperature coefficients, and temperature ranges. notice that a capacitor made with x5r material can lose up to 15% of its capacitance within its working temperature range. table 1. typical tolerance and temperature coefficient of capacitance by material material cog/npo x7r x5r typical tolerance 5% 10% 20% temperature coefficient 30 ppm 15% 15% temperature range, c ? 55/125 c ? 55/125 c ? 55/85 c high-k material is very sensitive to applied dc voltage. x5r capacitors have can have losses ranging from 15% to 45% of their initial capacitance with only half of their dc rated voltage applied. for example, if 5 vdc is applied to a 10 v, 1 m f x5r capacitor, the measured capacitance at that point may show between 0.55 m f and 0.85 m f. y5v capacitors have losses that can reach or exceed 50% to 75% of their rated value. the working capacitance of components made with high-k materials is generally much lower than nominal capacitance. a worst case result with a typical x5r material might be ? 10% tolerance, ? 15% temperature effect, and ? 45% dc voltage effect at 50% of the rated voltage. this particular case would result in a working capacitance of 42% (0.9 0.85 0.55) of the nominal value. select high-k ceramic capacitors according to the following rules: 1. use capacitors made of materials with temperature coefficients of x5r, x7r, or better. 2. use capacitors with dc voltage ratings of at least twice the application voltage, because high-k capacitor values generally are reduced by dc voltage. 25v capacitors are recommended when boost converter output is 10v. the minimum rating that should be used in this case is 16v, but correct operation should be verified carefully. 3. choose a capacitance value at least twice the nominal value calculated for the application. multiply the nominal value by a factor of 2 for safety. if a 10 m f capacitor is required, use 22 m f. copyright ? 2008, texas instruments incorporated submit documentation feedback 13 product folder link(s): tpa2100p1 0.8 cc l cc dd v i = i v ? ? ? ? ( ) dd cc dd l boost cc v v v l = i f v - d
tpa2100p1 capacitor equations (12) (13) decoupling capacitors input capacitors, c i (14) tpa2100p1 slos595 ? december 2008 ........................................................................................................................................................................................... www.ti.com the preceding rules and recommendations apply to capacitors used in connection with the tpa2100p1. the tpa2100p1 cannot meet its performance specifications if the rules and recommendations are not followed. the value of the boost capacitor is determined by the minimum value of working capacitance required for stability and the maximum voltage ripple allowed on v cc in the application. the minimum value of working capacitance is 10 m f. do not use any component with a working capacitance less than 10 m f. for x5r or x7r ceramic capacitors, equation 12 shows the relationship between the boost capacitance, c, to load current, load voltage, ripple voltage, input voltage, and switching frequency (i cc , v cc , v, v dd , f boost respectively). insert the maximum allowed ripple voltage into equation 12 to solve for c. a factor of 2 is included to implement the rules and specifications listed earlier. for aluminum or tantalum capacitors, equation 13 shows the relationship between he boost capacitance, c, to load current, load voltage, ripple voltage, input voltage, and switching frequency (i cc , v cc , v, v dd , f boost respectively). insert the maximum allowed ripple voltage into equation 12 to solve for c. solve this equation assuming esr is zero. capacitance of aluminum and tantalum capacitors is normally not sensitive to applied voltage so there is no factor of 2 included in equation 4 . however, the esr in aluminum and tantalum capacitors can be significant. choosing an aluminum or tantalum capacitor with esr around 30 m ? is acceptable. the tpa2100p1 is a high-performance class-d audio amplifier that requires adequate power supply decoupling to ensure the efficiency is high and total harmonic distortion (thd) is low. in addition to the 10 m f capacitor at v dd , place a 1 m f low esr capactior within 1 mm of the v dd pin to reduce higher frequency transients, spikes, or digital hash on the line. for the same reasons place a 1 m f low esr capactior within 1 mm of the v cc out pin in addition to the boost output capacitor. the tpa2100p1 does not require input coupling capacitors if the design uses a low offset differential source that is biased within the common mode input voltage range. note that source offset is amplified if no dc blocking capacitors are used. if the input signal is not biased within the recommended common-mode input range, if high pass filtering is needed, or if using a single-ended source, input coupling capacitors are required. the input capacitors and input resistors form a high-pass filter with the corner frequency, ? c , determined in equation 14 . the value of the input capacitor directly affects the bass (low frequency) performance of the circuit. piezo speakers cannot usually respond well to low frequencies, so the corner frequency can be set to block low frequencies and reduce speaker distortion in this application. not using input capacitors can increase output offset. use equation 15 to solve for the input coupling capacitance. if the corner frequency is within the audio band, the input capacitors should have a tolerance of 10% or better, because any mismatch in capacitance causes an impedance mismatch at the corner frequency and below. 14 submit documentation feedback copyright ? 2008, texas instruments incorporated product folder link(s): tpa2100p1 ( ) cc cc dd boost cc i v v c = 2 v f v - d ( ) cc cc dd boost cc i v v c = v f v - d c i i 1 = (2 r c ) f p
(15) board layout tpa2100p1 www.ti.com ........................................................................................................................................................................................... slos595 ? december 2008 in making the pad size for the wcsp balls, it is recommended that the layout use nonsolder mask defined (nsmd) land. with this method, the solder mask opening is made larger than the desired land area, and the opening size is defined by the copper pad width. figure 18 and table 2 shows the appropriate diameters for a wcsp layout. figure 18. land pattern dimensions table 2. land pattern dimensions (1) (2) (3) (4) solder pad solder mask (5) copper stencil (6) (7) stencil copper pad definitions opening thickness opening thickness nonsolder mask 275 m m 275 m m sq. 275 m m (+0.0, ? 25 m m) 375 m m (+0.0, ? 25 m m) 1 oz max (32 m m) 125 m m thick defined (nsmd) (rounded corners) (1) circuit traces from nsmd defined pwb lands should be 75 m m to 100 m m wide in the exposed area inside the solder mask opening. wider trace widths reduce device stand off and impact reliability. (2) best reliability results are achieved when the pwb laminate glass transition temperature is above the operating the range of the intended application (3) recommend solder paste is type 3 or type 4. (4) for a pwb using a ni/au surface finish, the gold thickness should be less 0,5 mm to avoid a reduction in thermal fatigue performance. (5) solder mask thickness should be less than 20 m m on top of the copper circuit pattern (6) best solder stencil performance is achieved using laser cut stencils with electro polishing. use of chemically etched stencils results in inferior solder paste volume control. (7) trace routing away from wcsp device should be balanced in x and y directions to avoid unintentional component movement due to solder wetting forces. copyright ? 2008, texas instruments incorporated submit documentation feedback 15 product folder link(s): tpa2100p1 i i c 1 c = (2 r ) f p copper trace width solder pad width solder maskopening copper trace thickness solder mask thickness
component location trace width efficiency and thermal information (16) (17) operation with dacs and codecs filter free operation tpa2100p1 slos595 ? december 2008 ........................................................................................................................................................................................... www.ti.com place all the external components as close as possible to the tpa2100p1. placing the decoupling capacitor as close as possible to the tpa2100p1 is important for the efficiency of the class-d amplifier. any resistance or inductance in the trace between the device and the capacitor can cause a loss in efficiency. recommended trace width at the solder balls is 75 m m to 100 m m to prevent solder wicking onto wider pcb traces. for high current pins (sw, vccout, vccin, gnd, and audio output pins) of the tpa2100p1, use 100 m m trace widths at the solder balls and at least 500 m m pcb traces to ensure proper performance and output power for the device. for the remaining signals of the tpa2100p1, use 75 m m to 100 m m trace widths at the solder balls. the audio input pins (in- and in+) must run side-by-side to maximize common-mode noise cancellation. the maximum ambient temperature depends on the heat-sinking ability of the pcb system. the derating factor for the packages are shown in the dissipation rating table. converting this to q ja for the wcsp package: given q ja of 75 c/w, the maximum allowable junction temperature of 150 c, and the maximum estimated internal dissipation of 1 w (driving 1 m f speaker with 6 vrms 15 khz sine wave, the maximum ambient temperature is calculated with equation 17 . equation 17 shows that the calculated maximum ambient temperature is 75 c at maximum power dissipation. the tpa2100p1 is designed with thermal protection that turns the device off when the junction temperature surpasses 150 c to prevent damage to the ic. using the resistor- speaker - resistor or the resistor - speaker load configurations dramatically increases the temperature of the tpa2100p1 since those configurations require a much higher output current. when using class-d amplifiers with codecs and dacs, sometimes there is an increase in the output noise floor from the audio amplifier. this occurs when the output frequencies of the codec/dac mix with the switching frequencies of the audio amplifier input stage. the tpa2100p1 has a built-in low-pass filter to reduce codec/dac out-of-band noise that could mix with the switching frequency of the class-d amplifier. a ferrite bead filter is not required for operation with the resistor ? speaker ? resistor load configuration or with the resistor ? speaker ? inductor load configuration. in order to achieve low radiated emissions, the resistor and/or inductor should be placed within 1 cm of the output of the amplifier and followed with a 100 pf to 1000 pf capacitor to gnd. figure 19 and figure 20 show typical load configurations to reduce radiated emissions. 16 submit documentation feedback copyright ? 2008, texas instruments incorporated product folder link(s): tpa2100p1 o ja 1 1 = = = 75 c/w derating factor 0.0133 o a j ja dmax t max = t max p = 150 75(1) = 75 c - -
tpa2100p1 www.ti.com ........................................................................................................................................................................................... slos595 ? december 2008 figure 19. typical radiated emissions suppression circuit (resistor-speaker-inductor load) figure 20. typical radiated emissions suppression circuit (resistor-speaker-resistor load) figure 21 shows the emc performance of figure 19 using a 1 m f load to simulate the speaker. table 3 list the measurement conditions. the worst-case quasi-peak margin is 14.4 db at 55.9 mhz. figure 21. measured radiated emissions ? vertical front copyright ? 2008, texas instruments incorporated submit documentation feedback 17 product folder link(s): tpa2100p1 out+ out- 330 pf 5 ~ 10 w 22 h m 330 pf piezo speaker 0.1 ~ 2 f m out+ out- 330 pf 5 ~ 10 w 5 ~ 10 w piezo speaker 0.1 ~ 2 f m 330 pf 30m f - fr equency - hz 0 10 20 30 40 50 60 70 lim it level - dbuv /m 230m 430m 630m 830m
tpa2100p1 slos595 ? december 2008 ........................................................................................................................................................................................... www.ti.com table 3. measurement conditions for radiated emissions of figure 21 parameter value unit v dd supply voltage 3.6 v a v gain 12 db f aud input signal frequency 1 khz v i input signal amplitude 1.3 v rms v o output signal amplitude 5.3 v rms c l load capacitance 1 m f cable length 25.4 mm antenna position vertical front ? for a full radiated emissions report, please contact your local ti representative. for operation with a resistor ? speaker load configuration the ferrite bead filter can often be used if the design is failing radiated emissions without an lc filter and the frequency sensitive circuit is greater than 1 mhz. this filter functions well for circuits that just have to pass fcc and ce because fcc and ce only test radiated emissions greater than 30 mhz. when choosing a ferrite bead, choose one with high impedance at high frequencies, and very low impedance at low frequencies. in addition, select a ferrite bead with adequate current rating to prevent distortion of the output signal. figure 22 shows a typical ferrite bead output filter. figure 22. typical ferrite bead filter (chip bead example: tdk: mpz1608y101b) 18 submit documentation feedback copyright ? 2008, texas instruments incorporated product folder link(s): tpa2100p1 out+ out- ferrite chip bead ferrite chip bead 1 nf 1 nf 10 ~ 20 w piezo speaker 0.1 ~ 2 f m
packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish msl peak temp (3) TPA2100P1YZHR active dsbga yzh 16 3000 green (rohs & no sb/br) snagcu level-1-260c-unlim tpa2100p1yzht active dsbga yzh 16 250 green (rohs & no sb/br) snagcu level-1-260c-unlim (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) eco plan - the planned eco-friendly classification: pb-free (rohs), pb-free (rohs exempt), or green (rohs & no sb/br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. tbd: the pb-free/green conversion plan has not been defined. pb-free (rohs): ti's terms "lead-free" or "pb-free" mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes. pb-free (rohs exempt): this component has a rohs exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. the component is otherwise considered pb-free (rohs compatible) as defined above. green (rohs & no sb/br): ti defines "green" to mean pb-free (rohs compatible), and free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material) (3) msl, peak temp. -- the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti to customer on an annual basis. package option addendum www.ti.com 16-apr-2009 addendum-page 1
tape and reel information *all dimensions are nominal device package type package drawing pins spq reel diameter (mm) reel width w1 (mm) a0 (mm) b0 (mm) k0 (mm) p1 (mm) w (mm) pin1 quadrant TPA2100P1YZHR dsbga yzh 16 3000 180.0 8.4 2.32 2.37 0.81 4.0 8.0 q1 tpa2100p1yzht dsbga yzh 16 250 180.0 8.4 2.32 2.37 0.81 4.0 8.0 q1 package materials information www.ti.com 17-dec-2008 pack materials-page 1
*all dimensions are nominal device package type package drawing pins spq length (mm) width (mm) height (mm) TPA2100P1YZHR dsbga yzh 16 3000 220.0 220.0 34.0 tpa2100p1yzht dsbga yzh 16 250 220.0 220.0 34.0 package materials information www.ti.com 17-dec-2008 pack materials-page 2

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